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Analysis of the characteristics of thick-film NTC thermistor devices manufactured by screen-printing and firing technique and by room temperature aerosol deposition method (ADM)

Michaela Schubert

Department of Functional Materials, University of Bayreuth, Universitätsstraße 30, D-95447 Bayreuth, Germany

E-mail Address: functional.materials@uni-bayreuth.de

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Jaroslaw Kita

Department of Functional Materials, University of Bayreuth, Universitätsstraße 30, D-95447 Bayreuth, Germany

E-mail Address: functional.materials@uni-bayreuth.de

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Christian Münch

Vishay Electronic GmbH, Dr.-Felix-Zandman-Platz 1, D-95100 Selb, Germany

E-mail Address: Christian.Muench@vishay.com

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, and

Ralf Moos

Department of Functional Materials, University of Bayreuth, Universitätsstraße 30, D-95447 Bayreuth, Germany

E-mail Address: functional.materials@uni-bayreuth.de

Corresponding author.

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https://doi.org/10.1142/S1793604717500734Cited by:8 (Source: Crossref)

Abstract

The study compares thick-film NTC thermistor devices, produced by the screen-printing (and firing) technique and by the Aerosol Deposition Method (ADM) at room temperature. The devices are compared with respect to film quality (optical, mechanical) and to the negative temperature coefficient of resistance (NTCR) parameters $ρ_{25}$ and $B$ . While the screen-printed films are porous, the Aerosol Deposited (AD) films are characterized by high tightness, mechanical stability, and a production at room temperature. The electrical analysis shows that the AD films reach the $ρ_{25}$ - and $B$ -values of bulk NTCRs from literature after a moderate tempering step below 400 $^{\circ}$ C in air. The screen-printed films show $B$ -values that are comparable to the values of bulk NTCRs from literature and $ρ_{25}$ -values that are significantly higher.

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