Book Series: WSPC Series in Advanced Integration and Packaging

Dr Shi-Wei Ricky Lee, Professor
Department of Mechanical Engineering
Hong Kong University of Science and Technology
Clear Water Bay, Kowloon
Hong Kong

Dr Bontae Han
Keystone Professor
Department of Mechanical Engineering
University of Maryland
College Park, MD 20742
USA

In the 21st century, innovative integration and packaging drives success in the marketplace, establishing the “look and feel” of electronic products and their price point, and enabling differentiation and branding. The rapid development and proliferation of design methodologies, assembly techniques, and thermal solutions for components ranging from integrated circuits to photonics, and from sensors and MEMS to mixed signals and power amplifiers, drive the often frenetic pace of exploration, discovery, and innovation characteristic of the electronic industry.

This recently introduced WSPC book series on “Advanced Integration and Packaging of Electronic Systems” (AIPack), with a particular focus on 2.5D and 3D form factors, will provide a “technology commons” for the packaging community, a place where ideas can be articulated, examined, and disseminated rapidly and efficiently through both print and electronic media. It is our hope that product developers will find AIPack a convenient and reliable source of technical information; that researchers and students will be guided to the challenges and barriers facing key technologies, and that technology managers and investors will find the tools and data needed to make broad technology assessments and comparisons for emerging packaging and integration technologies.

Our distinguished authors recently received some awards, namely, Dr Avram Bar-Cohen (2014 IEEE CPMT Award), Dr Ricky Lee, (2014 David Feldman Outstanding Contribution Award) and Dr. Madhavan Swaminathan (2014 CPMT Outstanding Sustained Technical Contribution Award).