MODFETs: OPERATION, STATUS AND APPLICATIONS

The following sections are included:

• Introduction

• Qualitative Description of MODFET Operation

• Analytical Description of MODFETs

• Fabrication Process

  • Gate formation

    • T-shaped gate

    • Multifinger gate

    • Dual gate

    • Offset recessed gate

    • Double recessed gate

  • Alloyed ohmic contacts

    • Primer

    • AuGe/Ni metallization for alloyed ohmic contact

    • AuGe/Au metallization for alloyed ohmic contact

    • AuGe/Ni/Au metallization for alloyed ohmic contact

    • Au/Ge/Ni/Ag metallization for alloyed ohmic contact

    • Ni/Ge/Au/Ni/Au metallization for alloyed ohmic contact

  • Non-alloyed ohmic contact

    • WSi metallization

  • Regrown ohmic contacts

  • Channel improvement

    • Synopsis

    • Strained layer channel

    • Striped channel

    • Delta (or lamella) doped channel

    • Superlattice-based channel

• Reliability

  • Synopsis

  • Degradation of ohmic contacts

  • Effect of temperature stress

  • Influence of defects and dislocations

  • Effect of transient radiation

• Applications

  • Monolithic microwave integrated circuits (MMICs)

    • Low-noise amplifiers

    • Power performance

• Conclusion

• Acknowledgements

• References