Classical and Computational Solid Mechanics 2nd Edition By (author): Y C Fung (University of California, San Diego, USA), Pin Tong (University of California, San Diego, USA & Hong Kong University of Science and Technology, China) & Xiaohong Chen (UTC Aerospace Systems, USA) "... this is a good, comprehensive, unified presentation of much of the field of solid mechanics, written by two well-regarded researchers in that field." Applied Mechanics Reviews
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Encyclopedia of Thermal Packaging Set 1: Thermal Packaging Techniques (A 6–Volume Set) Edited by: Avram Bar-Cohen (University of Maryland, USA) "The Encyclopedia meets head-on the challenges engineers and researchers face in this era of information abundance. By its breadth of coverage, the Encyclopedia provides a bird's eye view of the techniques and approaches used over the entire field of electronics thermal management. By its depth of coverage, each volume provides the reader with a comprehensive guide to a specific subject area. This is undoubtedly a milestone publication that will serve the industry and the research community for many years to come.” Dr Wataru Nakayama
Research Consultant ThermTech International |
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Advanced Series in Biomechanics
Volume 4-An Introductory Text to Bioengineering
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Advanced Series on Ocean Engineering
This book series consists of undergraduate and graduate textbooks, research and engineering design reference books and monographs in the field of coastal and ocean engineering. |