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Inverse Method to Investigate Thermal Behavior for Hot Stamping

    https://doi.org/10.1142/9789813140622_0057Cited by:0 (Source: Crossref)
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    Abstract:

    Thermal contact resistance between sheet metal and die is the key fact of influencing parameters in thermal and physical properties of the heat transfer in hot stamping process. Based on the cooling curves of blank and flat die obtained by experiment, the inverse heat conduct problem is solved by using sequential function method (SFM) and the thermal contact resistance is calculated.