SURFACE ENERGY EFFECT ON POLYMERS ADHESIVE BONDING AT ROOM TEMPERATURE

The effect of different surface energies of substrate on adhesive bonding at room temperature is investigated in this paper. Comparing to the RCA cleaning procedure, the improved cleaning procedure increases surface energies of wafers which were detected by water contact angle (WCA) measured with JY-82 contact angle goniometer. This higher surface energy leads to stronger bonding properties between Si and glass with epoxy (TS814) at room temperature. The bonding strength was detected by Series IX Automated Materials Testing System. Compared with the RCA cleaning simples, the one with high surface energy of wafers reached 8.56Mpa, more than seven times stronger than the others.