Experimental Methods & EquipmentNo Access

TESTING METHOD FOR MEASURING IMPACT STRENGTH OF BGA SOLDER JOINTS ON ELECTRONIC PACKAGE

Department of Mechanical Sciences and Engineering, Tokyo Institute of Technology, 2-12-1 Ookayama, Meguro-ku, Tokyo 1528552, Japan

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HIROTAKA GOTO

Enterprise Solution Division, NTT Comware Corporation, 1-6 Nakase, Mihama-ku, Chiba, 2610023, Chiba, Japan

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WAKAKO ARAKI

Department of Mechanical Sciences and Engineering, Tokyo Institute of Technology, 2-12-1 Ookayama, Meguro-ku, Tokyo 1528552, Japan

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TAKAHIRO OMORI

Mechanical Systems Laboratory, Corporate Research & Development Center, Toshiba Corporation, 1, Komukai Toshiba-cho, Saiwai-ku, Kawasaki, 2128582, Japan

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NORIYASU KAWAMURA

PC Development Center, Toshiba Corporation Parsonal Computer & Network Company, 2-9,Suehiro-cho, Ome, Tokyo, 1988710, Japan

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MINORU MUKAI

Mechanical Systems Laboratory, Corporate Research & Development Center, Toshiba Corporation, 1, Komukai Toshiba-cho, Saiwai-ku, Kawasaki, 2128582, Japan

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, and

TAKASHI KAWAKAMI

Mechanical Systems Laboratory, Corporate Research & Development Center, Toshiba Corporation, 1, Komukai Toshiba-cho, Saiwai-ku, Kawasaki, 2128582, Japan

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https://doi.org/10.1142/S021797920804630XCited by:0 (Source: Crossref)

Abstract

A pendulum-impact testing machine was developed to measure the impact strength of ball-grid-array (BGA) solder joints between an electronic package and a circuit board. Ball solders were connected to daisy-chain between a dummy electronic package and a circuit board. The upper side of the package was directly bonded to a load cell. The rear side of the circuit board was also bonded to an aluminum alloy block fixed on a base. A pendulum made of aluminum alloy was collided into the load cell to apply tensile impact to the solder joints through the load cell. The history of the impact load could be controlled by raising the angle of the pendulum. The fracture of a BGA solder joint was detected by measuring the resistance of the daisy-chain circuit on the board. Therefore, the impact strengths of the solder joints at electrical disconnection and mechanical breaking of all joints could be determined. The experimental results showed that this method is useful for measuring the impact strength of BGA solder joints.

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References

S. W. R. Lee, Y. L. T. Li and H. W. B. Lui, Proc of IMECE2002 (ASME, 2002) pp. 181–185. Google Scholar
K. Mishiroet al., Microelectronics Reliability 42, 77 (2002), DOI: 10.1016/S0026-2714(01)00230-X. Crossref, Web of Science, Google Scholar
Q. Yuet al., Proc of ITherm'2002 (IEEE, 2002) pp. 953–960. Google Scholar
Y. Y. Wang, T. Y. Lin and L. Hua, Mechatronlcs 13, 427 (2003), DOI: 10.1016/S0957-4158(01)00080-0. Crossref, Web of Science, Google Scholar
E. H. Wonget al., Proceedings of IPACK03 (ASME, 2003) pp. 757–763. Google Scholar
Q. Yuet al., Proc of ITherm'2004 (IEEE, 2004) pp. 336–342. Google Scholar
E. H. Wong, Y. W. Mai and S. K. W. Seah, J. of Electronic Packaging 127, 496 (2005), DOI: 10.1115/1.2065747. Crossref, Web of Science, Google Scholar
L. Zhu and W. Marcinkiewicz, IEEE Trans, on components and Packing Technol. 28, 449 (2005). Web of Science, Google Scholar
D. Reiff and E. Bradley, 2005 Proc 55th Electronic Components and Tech. Conf. (IEEE, 2005) pp. 1519–1525. Google Scholar
Y. R. D. Changet al., Microelectronics Reliability 46, 1160 (2006), DOI: 10.1016/j.microrel.2005.12.008. Crossref, Web of Science, Google Scholar
C. L. Yeh, Y. S. Lai and C. L. Kao, Microelectronics Reliability 46, 1172 (2006), DOI: 10.1016/j.microrel.2005.09.002. Crossref, Web of Science, Google Scholar
A. Kongcharoen, S. Trongjitwikrai and S. Netphu, Advanced Packaging 11, 23 (2002). Google Scholar
K. Mimuraet al., J. Soc. Mat. Sci., Japan 45, 939 (1996). Crossref, Google Scholar