Session F: Novel Materials Processing TechnologyNo Access

FAILURE BEHAVIORS OF FLIP CHIP SOLDER JOINTS UNDER VARIOUS LOADING CONDITIONS OF HIGH-SPEED SHEAR TEST

School of Advanced Materials Science & Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, Korea

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SANG-OK HA

School of Advanced Materials Science & Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, Korea

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JIN-KYU JANG

School of Advanced Materials Science & Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, Korea

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JONG-WOONG KIM

School of Advanced Materials Science & Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, Korea

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JONG-BUM LEE

School of Advanced Materials Science & Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, Korea

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, and

SEUNG-BOO JUNG

School of Advanced Materials Science & Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, Korea

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https://doi.org/10.1142/S0217979209061664Cited by:2 (Source: Crossref)

Abstract

The failure behaviors of flip chip solder joints under various loading conditions of the high-speed shear test (H-SST) were investigated with an experimental and non-linear 3-dimensional finite element modeling study. The solder composition used in this study was Sn-3.0Ag-0.5Cu (in wt.%). The shear forces were far greater by H-SST than by low-speed shear test (L-SST). The shear force further increased with increasing shear speed, mainly due to the high strain-rate sensitivity of the solder alloy. Brittle interfacial fractures were more easily achieved by H-SST, especially at the higher shear speed. This was discussed in terms of the relationship between the strain-rate and work-hardening effect and the resulting stress concentration at the interfacial regions

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