Microstructure evolution and mechanical properties of copper/304 stainless-steel joints by low-temperature soldering
Abstract
Pure copper (Cu) soldering joints with 304 stainless steel (SS) at different soldering temperatures (240–350∘C) were prepared by using Sn–3.5 Ag (wt.%) as a soldering filler-metal material. The mechanical properties and microstructure evolution were investigated. Sound Cu/304 SS joints were obtained by soldering at 240–350∘C for 90 s and the highest average joint shear strength was ∼39 MPa when brazed at 300∘C. The Cu6Sn5 and Ag3Sn phases were typical intermetallic compounds (IMCs) in the joints at a soldering temperature of 240∘C. Cu3Sn IMCs were formed at the Cu/Cu6Sn5 interface as the soldering temperature increased to 300∘C and above. Shear fracture analysis by scanning electron microscopy (SEM) with energy dispersive spectroscopy showed that the joints fractured mostly inside the Cu6Sn5 layers.
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