MICROSTRUCTURE AND PROPERTIES OF SiC PARTICLES REINFORCED COPPER BASED ALLOY COMPOSITE
Abstract
Copper-matrix composites reinforced with SiC particles are prepared by mechanical alloying. The microstructure characteristics, relative density, hardness, tensile strength, electrical conductivity, thermal conductivity and wear properties of the composites are investigated in this paper. The results indicate that the relative density, macro-hardness and mechanical properties of composites are improved by modifying the surface of SiC particles with Cu and Ni. The electrical conductivity and thermal conductivity of composites, however, are not obviously improved. For a given volume fraction of SiC, the Cu/SiC(Ni) has higher mechanical properties than Cu/SiC(Cu). The wear resistance of the composites are improved by the addition of SiC. The composites with optimized interface have lower wear rate.
