World Scientific
Skip main navigation

Cookies Notification

We use cookies on this site to enhance your user experience. By continuing to browse the site, you consent to the use of our cookies. Learn More
×

System Upgrade on Tue, May 28th, 2024 at 2am (EDT)

Existing users will be able to log into the site and access content. However, E-commerce and registration of new users may not be available for up to 12 hours.
For online purchase, please visit us again. Contact us at customercare@wspc.com for any enquiries.

Effect of current density on the deposit stress in gold electroplating

    https://doi.org/10.1142/S0217984917501883Cited by:0 (Source: Crossref)

    As the key components of grating-based X-ray phase contrast imaging, absorption gratings are essential to be fabricated. In fact, the internal stress is one of the critical issues for the application of the electroplated gold deposit as the absorption metal for absorption gratings. It is common that high internal stress levels can cause the deposit cracking, blistering and peeling away from the substrate material. This study investigates the effect of current density on the internal stress by the bent strip method. The surface morphologies of gold deposits are examined using scanning electron microscopy (SEM) and the crystal structure of the electroplated deposit is analyzed by X-ray diffraction (XRD). The change of current density reverses the internal stress of the deposits from compressive to tensile. The value of deposit stress can be near zero by optimizing the current density.