Research PapersNo Access

Simulation and test of the thermal behavior of pressure switch

Yifang Liu

http://orcid.org/0000-0003-3800-5512

School of Aerospace Engineering, Xiamen University, 422, Siming Road South, Xiamen 361005, China

E-mail Address: yfliu@xmu.edu.cn

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Daner Chen

School of Aerospace Engineering, Xiamen University, 422, Siming Road South, Xiamen 361005, China

E-mail Address: chendaner@stu.xmu.edu.cn

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Yao Zhang

School of Aerospace Engineering, Xiamen University, 422, Siming Road South, Xiamen 361005, China

E-mail Address: zhangyao@stu.xmu.edu.cn

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, and

Tingting Dai

School of Aerospace Engineering, Xiamen University, 422, Siming Road South, Xiamen 361005, China

E-mail Address: 35120171150993@stu.xmu.edu.cn

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https://doi.org/10.1142/S0217984918501385Cited by:0 (Source: Crossref)

Abstract

Little, lightweight, low-power microelectromechanical system (MEMS) pressure switches offer a good development prospect for small, ultra-long, simple atmosphere environments. In order to realize MEMS pressure switch, it is necessary to solve one of the key technologies such as thermal robust optimization. The finite element simulation software is used to analyze the thermal behavior of the pressure switch and the deformation law of the pressure switch film under different temperature. The thermal stress releasing schemes are studied by changing the structure of fixed form and changing the thickness of the substrate, respectively. Finally, the design of the glass substrate thickness of 2.5 mm is used to ensure that the maximum equivalent stress is reduced to a quarter of the original value, only 154 MPa when the structure is in extreme temperature (80 $^{\circ}$ $^{\circ}$ C). The test results show that after the pressure switch is thermally optimized, the upper and lower electrodes can be reliably contacted to accommodate different operating temperature environments.

Keywords:

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