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MACRODROPLET REDUCTION AND GROWTH MECHANISMS IN CATHODIC ARC PHYSICAL VAPOR DEPOSITION OF TiN FILMS

MUBARAK ALI

Department of Physics, COMSATS Institute of Information Technology (CIIT), Park Road, Islamabad, Pakistan

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ESAH HAMZAH

Faculty of Mechanical Engineering, Universiti Teknologi Malaysia, 81310, Skudai, Johor, Malaysia

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TAHIR ABBAS

Department of Physics, Bahauddin Zakariya University, Multan, 60800, Pakistan

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MOHD RADZI HJ. MOHD TOFF

Advanced Materials Research Center (AMREC), SIRIM Berhad, Kulim Hi-Tech Park, 09000 Kulim, Kedah, Malaysia

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, and

ISHTIAQ A. QAZI

National University of Sciences and Technology, Tamiz-ud-din Road, Rawalpindi, Pakistan

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https://doi.org/10.1142/S0218625X08011810Cited by:13 (Source: Crossref)

Abstract

Cathodic arc physical vapor deposition (CAPVD) a technique used for the deposition of hard coatings for tooling applications has many advantages. The main drawback of this technique is the formation of macrodroplets (MDs) during deposition resulting in films with rougher morphology. The MDs contamination and growth mechanisms was investigated in TiN coatings over high-speed steel, as a function of metal ion etching, substrate bias, and nitrogen gas flow rate; it was observed that the latter is the most important factor in controlling the size and number of the macrodroplets.

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