Research ArticleNo Access

A Hybrid Method for Predicting Fatigue Life of Lead-Free Solder Joints Under Coupled Electrical–Thermal–Mechanical Fields

J. L. Yi

School of Mechanical Engineering, Tianjin University, Tianjin 300350, P. R. China

These authors are co-first authors.

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J. H. Chen

Aerospace Research Institute of Materials and Processing Technology, Beijing 102211, P. R. China

These authors are co-first authors.

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C. Qu

School of Mechanical Engineering, Tianjin University, Tianjin 300350, P. R. China

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Y. X. Zhang

School of Engineering, Design and Built Environment, Western Sydney University, Penrith, NSW 2751, Australia

E-mail Address: Sarah.Zhang@westernsydney.edu.au

Corresponding authors.

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, and

Y. H. Cui

https://orcid.org/0000-0003-2049-6130

School of Mechanical Engineering, Tianjin University, Tianjin 300350, P. R. China

E-mail Address: yhcui@tju.edu.cn

Corresponding authors.

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https://doi.org/10.1142/S1758825122500570Cited by:3 (Source: Crossref)

Abstract

A hybrid method was developed in this study for fatigue life prediction (FLP) of lead-free solder (LFS) joints in ball grid array package under the coupled electrical–thermal–mechanical (ETM) fields. A modified constitutive model for lead-free solder joints under coupled ETM fields was proposed to describe the mechanical and fatigue behavior of solder joints under coupled ETM fields. A modified damage model under coupled ETM fields was then developed to obtain the fatigue life of LFS joints under coupled ETM fields. Uniaxial tension tests of an Sn–3.0Ag–0.5Cu (SAC305) solders and coupled multifields fatigue experiments were performed to verify the accuracy, applicability and validity by the modified constitutive model and fatigue damage model under coupled ETM fields. Based on the modified constitutive model and fatigue damage model, a hybrid method, including current, temperature and mechanics parameters, was proposed for the FLP of the LFS joints, which was demonstrated to be able to predict the results well. A hybrid method provides an idea for investigating the fatigue life of lead-free solder joints in coupled fields.

Keywords:

References

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