World Scientific
Skip main navigation

Cookies Notification

We use cookies on this site to enhance your user experience. By continuing to browse the site, you consent to the use of our cookies. Learn More
×

System Upgrade on Tue, May 28th, 2024 at 2am (EDT)

Existing users will be able to log into the site and access content. However, E-commerce and registration of new users may not be available for up to 12 hours.
For online purchase, please visit us again. Contact us at customercare@wspc.com for any enquiries.

Simulating the stress–strain state of a thin plate after a thermal shock

    https://doi.org/10.1142/S1793962322500246Cited by:3 (Source: Crossref)

    The paper is devoted to simulating the impact of a thermal shock on a thin homogeneous plate in the ANSYS package. The assessment of the stress–strain state is carried out and the dynamics of changes in the temperature field of the plate is determined. The obtained results were compared with the data of other authors and can be used when taking into account the thermal shock of large elastic elements of spacecraft.