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CHAPTER 4: Wire Bonding Process

    https://doi.org/10.1142/9789811209666_0004Cited by:0 (Source: Crossref)
    Abstract:

    In this chapter, more details of the wire bonding process will be discussed. The wire bonding process is discussed in four areas including free air ball (FAB) formation process, first bond process, second bond process and looping process. This chapter is most useful to wire bonding process engineers and package designers who may want more detailed knowledge on wire bonding process capability and design rules.