World Scientific
Skip main navigation

Cookies Notification

We use cookies on this site to enhance your user experience. By continuing to browse the site, you consent to the use of our cookies. Learn More
×

System Upgrade on Tue, May 28th, 2024 at 2am (EDT)

Existing users will be able to log into the site and access content. However, E-commerce and registration of new users may not be available for up to 12 hours.
For online purchase, please visit us again. Contact us at customercare@wspc.com for any enquiries.

NUMERICAL SIMULATION MICROSTRUCTURE MORPHOLOGY EVOLUTION AND SOLUTE MICROSEGREGATION OF Al-Si-Cu TERNARY ALLOYS DURING SOLIDIFICATION PROCESS

    The paper was financial support by NSFC and 973 Program, Grant No. 50704006 and 2010CB735811.

    https://doi.org/10.1142/9789814322799_0068Cited by:0 (Source: Crossref)
    Abstract:

    A 2D microstructure and solute microsegregation model of Al-Si-Cu ternary alloys is presented by using cellular automaton(CA) method. In CA model, an improved algorithm was presented that abandoned the assumption of solid/liquid interface position and velocity so as to calculate the solid fraction in the solid/liquid interface unit. Then, using CA model, a dendrite of Al-Si-Cu ternary alloys is simulated. Finally, solidification microstructure and solute microsegregation are simulated, and the simulated results can reflect the microstructure and different solute microsegregation during solidification process.