NUMERICAL SIMULATION MICROSTRUCTURE MORPHOLOGY EVOLUTION AND SOLUTE MICROSEGREGATION OF Al-Si-Cu TERNARY ALLOYS DURING SOLIDIFICATION PROCESS
The paper was financial support by NSFC and 973 Program, Grant No. 50704006 and 2010CB735811.
A 2D microstructure and solute microsegregation model of Al-Si-Cu ternary alloys is presented by using cellular automaton(CA) method. In CA model, an improved algorithm was presented that abandoned the assumption of solid/liquid interface position and velocity so as to calculate the solid fraction in the solid/liquid interface unit. Then, using CA model, a dendrite of Al-Si-Cu ternary alloys is simulated. Finally, solidification microstructure and solute microsegregation are simulated, and the simulated results can reflect the microstructure and different solute microsegregation during solidification process.