COMPARISON OF STRESS RELIEF MECHANISMS OF METAL FILMS DEPOSITED ON LIQUID SUBSTRATES BY THERMAL EVAPORATING AND SPUTTERING

Various metal film systems, deposited on liquid (silicone oil) substrates by thermal evaporating and DC-magnetron sputtering methods, have been successfully fabricated and the stress relief mechanisms are systematically studied by analyzing the characteristic surface morphologies. The experiment shows that the evaporating metal films can move on silicone oil surfaces freely due to the nearly zero adhesion of solid–liquid interface, which results in spontaneous formation of ordered surface patterns with a characteristic sandwiched structure driven by the internal stress. For the sputtering metal film system, however, the top surface of silicone oil can be modified to form an elastomeric polymer layer on the liquid substrate during deposition. Subsequent cooling of the system creates a higher compressive stress in the film, which is relieved by buckling of the film to form periodic wavy structures because the adhesion of solid–elastomer interface is quite strong.