Materials Electronic Device ApplicationsNo Access

Heat pipe cooling system of high-power three-level explosion-proof inverter based on the loss calculation and finite element analysis

Yuan Li

School of Electrical and Photo Electronic Engineering, Changzhou Institute of Technology, Changzhou, Jiangsu 213002, China

E-mail Address: smartwave@163.com

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https://doi.org/10.1142/S021798491740005XCited by:0 (Source: Crossref)

Abstract

The special using condition of high-power three-level explosion-proof inverter limits its cooling system within heat pipe and water-cooled cooling systems. How to calculate these two systems quantitatively to provide references for engineering application becomes one of the critical problems. In this paper, the principle of three-level explosion-proof was introduced first, and the power-loss generation theory was described and deduced into equations. Secondly, the heat pipe cooling system theory calculation was conducted based on the power losses of power devices, and the whole cooling system model was built by using finite element analysis. Finally, the temperature rise experiment was carried out on a 1 MW high-power three-level explosion-proof inverter, and the results proved the feasibility of this theory and its accuracy of analysis.

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References

1. L. K. Mestha and P. D. Evans, IEE Proc. B 136(4) (1989) 189. Google Scholar
2. M. Kurokawa, Y. Konishi, H. Iwamoto and M. Nakaoka, in Proc. 26th Ann. Conf. IEEE Ind. Electron. Society (2000), pp. 350–355. Google Scholar
3. M. G. H. Aghdam, S. H. Fathi and A. Ghasemi, IEEE PEDS (2005), pp. 209–218. Google Scholar
4. D. Huebner et al., J. Tsinghua Univ. 40(3) (2000) 5. Google Scholar
5. K. Berringer, J. Marvin and P. Perruchoud, IEEE Conf. IAS’95, Vol. 1 (1995), pp. 882–888. Google Scholar
6. C.-S. Yun, P. Malberti, M. Ciappa and W. Fichtner, IEEE Trans. Adv. Packaging 24(3) (2001). Crossref, Google Scholar
7. M. Han, S.-D. Lee, C. Hong and C.-S. Yang, The 7th Int. Conf. Power Electronics, EXCO, Daegu, Korea, 22–26 October 2007. Google Scholar
8. J. Hu, J. Li, J. Zou and J. Tan, J. Electr. Eng. Technol. 24(3) (2009). Crossref, Google Scholar
9. Z. Zhang, G. Xu and X. Shen, J. Tongji Univ. (Nat. Sci. Edn.) 32(6) (2004) 775. Google Scholar
10. D. Wang et al., Power Electron. Technol. 33(2) (2005) 115. Google Scholar
11. J. Yu, H. Gao and X. Yongji, Electronic Equipment Thermal Design and Analysis Techniques (Beijing Aerospace University Press, Beijing, 2008). Google Scholar
12. Y. Liu, J. Hunan Univ. Technol. 21(4) (2007) 77. Google Scholar
13. K. Zhu et al., J. Eng. Therm. Phys. 31(11) (2010) 1945. Google Scholar
14. W. Jing, G. Tan and Z. Ye, J. Electrotech. 26(2) (2011) 134. Google Scholar