Please login to be able to save your searches and receive alerts for new content matching your search criteria.
The dynamic propagation of a crack in a functionally graded piezoelectric material (FGPM) interface layer between two dissimilar piezoelectric layers under anti-plane shear is analyzed using the integral transform approaches. The properties of the FGPM layers vary continuously along the thickness. FGPM layer and the two homogeneous piezoelectric layers are connected weak-discontinuously. A constant velocity Yoffe-type moving crack is considered. Numerical values on the dynamic energy release rate (DERR) are presented for the FGPM. Followings are helpful to increase of the resistance of the crack propagation of the FGPM interface layer: (a) certain direction and magnitude of the electric loading; (b) increase of the thickness of the FGPM interface layer; (c) increase of the thickness of the homogeneous piezoelectric layer which has larger material properties than those of the crack plane in the FGPM interface layer. The DERR always increases with the increase of crack moving velocity and the gradient of the material properties.
Intraband transitions of an impurity electron from the ground state to 2Px and 2Py excited states of a shallow donor located near a semiconductor-metal interface are investigated as a function of the donor distance from the interface. Impurity states are calculated within the effective mass approximation and using a variational scheme in which the energies and the oscillator strength for the intraband absorption are obtained analytically.