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articleNo Access
STUDY OF ELECTROLESS NICKEL ON POLISHED SILICON FOR MEMS APPLICATIONS
- V. PRADEEP KUMAR and
- S. KARMALKAR
International Journal of Computational Engineering Science01 Sep 2003
Preview Abstract
Electroless nickel plating is an important process in the fabrication of metal microstructures on silicon substrates. Adhesion of the metal film to the substrate is a key parameter. We report a study of the adhesion of electroless nickel plating on polished silicon for different surface treatments (prior to plating), substrate areas and plating durations. Three different surface treatments considered are: mild etching, palladium activation and nickel activation. Adhesion strength in excess 9.8 × 10⁷N / m² has been obtained. Adhesion requirements for using nickel plating for masking the silicon substrate during anisotropic etching is also discussed.

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