Additively Manufactured, Flexible 5G Electronics for MIMO, IoT, Digital Twins, and Smart Cities Applications
This chapter appeared previously on the International Journal of High Speed Electronics and Systems. To cite this chapter, please cite the original article as the following: T. W. Callis, K. Hu, H. A. Jamal and M. M. Tentzeris, Int. J. High Speed Electron. Syst., 33, 2440066 (2024), doi:10.1142/S0129156424400664.
This review encompasses additive manufacturing techniques for crafting 5G electronics, showcasing how these methods innovate device creation with novel examples. A wearable phased array device on commonplace 3D printed material is described, with integrated microfluidic cooling channels used for thermal regulation of integrated circuit bulk components. Mechanical and electrical tunability are exemplified in an origamiinspired phased array structure. A 3D printed IoT cube structure shows the flexibility in the number of geometries additively manufactured 5G devices can adhere to. Finally, integrating 3D optical lenses with 5G electronics is shown.
