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Trade-offs in High-Speed Serial Link ICs

Shenggao Li

Intel Corporation, Fremont, CA 94538, USA

44235 Nobel Dr., Fremont, CA 94538.

https://doi.org/10.1142/S0129156405003338Cited by:0 (Source: Crossref)

Abstract

Serial IOs are widely used to expand the system bandwidth in communication systems. This paper provides an overview of serial IO design trade-offs with regard to power, cost, and performance. Circuit techniques are discussed to achieve low jitter and high bandwidth.

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References

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Vol. 15, No. 03

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Trade-offs in High-Speed Serial Link ICs

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