APPLICATION OF 25 NM QUANTUM DOT GATE FETs TO THE DESIGN OF ADC AND DAC CIRCUITS
Abstract
This paper describes design of analog-to-digital converters (ADCs) and digital-to-analog onverters (DACs) using field-effect transistors that exhibit three states in their transfer characteristics. An intermediate state "i" has been observed in the transfer characteristics (drain current-gate voltage) of FETs when two layers of cladded quantum dots (e.g. SiOx-Si and GeOx-Ge) are introduced in the gate region above the tunnel insulator between the source and drain regions. Three states in such a transistor, defined as quantum dot gate field-effect transistor (QDG-FET) include two stable states (ON and OFF) and a low-current saturation state "i" in its transfer characteristics. QDG-FETs are quite different in construction than nanodot based nonvolatile memories, reported in the literature, where the quantum dots are sandwiched between a tunnel gate insulator and a relatively thick control gate dielectric.
In this paper we present analog-to-digital converters (ADCs) using comparators based on QDG-FETs. A comparator is designed with fewer three-state QDG-FETs. Designs of 3-bit ADC, using 25 nm QDG-FETs, are simulated showing a signal-to-noise ratio (SNR) of ~18. In addition, the R-2R ladder problem, encountered in conventional analog-to digital converters (ADCs), is absent in QDG-FET based architecture.
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