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Crosstalk Induced Delay Analysis of Randomly Distributed Mixed CNT Bundle Interconnect

Manoj Kumar Majumder

Department of Electronics and Communication Engineering, Indian Institute of Technology Roorkee, India

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Pankaj Kumar Das

Department of Electronics and Communication Engineering, Sant Longowal Institute of Engineering and Technology, India

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Vobulapuram Ramesh Kumar

Department of Electronics and Communication Engineering, Indian Institute of Technology Roorkee, India

Corresponding author.

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Brajesh Kumar Kaushik

Department of Electronics and Communication Engineering, Indian Institute of Technology Roorkee, India

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https://doi.org/10.1142/S0218126615501455Cited by:24 (Source: Crossref)

Abstract

In this paper, a more realistic analytical model for randomly distributed mixed carbon nanotube (CNT) bundle (MCB) is presented for the analysis of crosstalk induced delay. Several researchers have proposed analytical models for interconnects based on single-walled CNT (SWCNT), multi-walled CNT (MWCNT) bundle and most interestingly, spatially arranged mixed CNTs. Although, bundled SWCNTs and MWCNTs are easily realizable, but, practically it is almost impossible to fabricate a MCB with precise arrangements of SWCNTs and MWCNTs. Motivated by these facts, this paper presents a corner placement algorithm for randomly distributed SWCNTs and MWCNTs of different diameters in a MCB. The performance of MCB is compared with that of conventional bundled SWCNT and bundled MWCNT at different coupled interconnect lengths and spacing. Encouragingly, for a fixed cross-sectional area, the overall crosstalk induced delay of MCB reduces by 65.03% and 23.54% in comparison to the bundles having either SWCNTs or MWCNTs with smaller diameters, respectively. However, in contradiction to most of the previously reported results, bundled MWCNTs with larger diameters outperform the randomly distributed MCBs in terms of crosstalk performance.

This paper was recommended by Regional Editor Piero Malcovati.

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