A new type of MEMS 3D package is introduced: stacked die Thick Quad Flat Non-lead (TQFN), for application as a multiple axis linear accelerometer. Both solder joint and die reliability during board level thermal cycling test are important concerns, as they affect the functionality and quality of the product. Design analyses are performed to study the effects of 12 key design variations in package dimensions and material properties, on solder joint reliability.

Keywords:

References

R. Darveaux, Effect of Simulation Methodology on Solder Joint Crack Growth Correlation, Proc. 50th ECTC Conference, Las Vegas, NE (2000) 1048-1058 . Google Scholar
T. Y. Tee, H. S. Ng, J. Diot, G. Frezza, R. Tiziani and G. Santospirito, Comprehensive Design Analysis of QFN and PowerQFN Packages for Enhanced Board Level Solder Joint Reliability, Proc. 52nd ECTC Conference, San Diego, CA (2002) 985-991 . Google Scholar
T. Y. Tee, M. Lim, H. S. Ng, X. Baraton, D. Kaire and Z. W. Zhong, Design Analysis of Solder Joint Reliability for Stacked Die Mixed Flip-Chip and Wirebond BGA, Proc. 4th EPTC Conference, Singapore (2002) 391-397 . Google Scholar
W. W. Lee, L. T. Nguyen and G. S. Selvaduray, Microelectronics Reliability 40, 231 (2000). Crossref, Google Scholar