Please login to be able to save your searches and receive alerts for new content matching your search criteria.
A new type of MEMS 3D package is introduced: stacked die Thick Quad Flat Non-lead (TQFN), for application as a multiple axis linear accelerometer. Both solder joint and die reliability during board level thermal cycling test are important concerns, as they affect the functionality and quality of the product. Design analyses are performed to study the effects of 12 key design variations in package dimensions and material properties, on solder joint reliability.