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Chapter 1: Introduction
https://doi.org/10.1142/9789814699020_0001Cited by:0 (Source: Crossref)
Abstract:
The following sections are included:
Thousand-core On-chip
State-of-the-Art Many-core Microprocessors
Memory-logic Integration
2D Integration Challenges
Scalability
Channel Loss
I/O Circuit Design
Testing
Thermal Management
Power Management
I/O Management
3D Integration
2.5D Integration
Organization of the Book
