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This publication considers the use of a variety of additive manufacturing techniques in the development of wireless modules and sensors. The opportunities and advantages of these manufacturing techniques are explored from an application point of view. We discuss first the origami (4D-printed) structures which take advantage of the ability to alter the shape of the inkjet-printed conductive traces on the paper substrate to produce a reconfigurable behavior. Next, focus is shifted towards the use of additive manufacturing technology to develop skin-like flexible electrical system for wireless sensing applications. We then discuss the development of a fully flexible energy autonomous body area network for autonomous sensing applications, the system is fabricated using 3D and inkjet printing techniques. Finally, an integration of inkjet and 3D printing for the realization of efficient mm-wave 3D interconnects up to 60GHz is discussed.

This publication provides an overview of additive manufacturing techniques including Inkjet, 3D and 4D printing methods. The strengths, opportunities and advantages of this array of manufacturing techniques are evaluated at different scales. We discuss first the applicability of additive manufacturing techniques at the device scale including the development of origami inspired tunable RF structures as well as the development of skin-like conformal, flexible systems for wireless/IoT, Smartag and smart city applications. We then discuss application at the package scale with on package printed antennas and functional packaging applications. Following this, there is a discussion of additive manufacturing techniques in applications at the die scale such as 3D printed interconnects. The paper is concluded with an outlook on future advancements at the component scale with the potential for fully printed passive components.

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This publication provides an overview of additive manufacturing techniques including Inkjet, 3D and 4D printing methods. The strengths, opportunities and advantages of this array of manufacturing techniques are evaluated at different scales. We discuss first the applicability of additive manufacturing techniques at the device scale including the development of origami inspired tunable RF structures as well as the development of skin-like conformal, flexible systems for wireless/IoT, Smartag and smart city applications. We then discuss application at the package scale with on package printed antennas and functional packaging applications. Following this, there is a discussion of additive manufacturing techniques in applications at the die scale such as 3D printed interconnects. The paper is concluded with an outlook on future advancements at the component scale with the potential for fully printed passive components.

This publication considers the use of a variety of additive manufacturing techniques in the development of wireless modules and sensors. The opportunities and advantages of these manufacturing techniques are explored from an application point of view. We discuss first the origami (4D-printed) structures which take advantage of the ability to alter the shape of the inkjet-printed conductive traces on the paper substrate to produce a reconfigurable behavior. Next, focus is shifted towards the use of additive manufacturing technology to develop skin-like flexible electrical system for wireless sensing applications. We then discuss the development of a fully flexible energy autonomous body area network for autonomous sensing applications, the system is fabricated using 3D and inkjet printing techniques. Finally, an integration of inkjet and 3D printing for the realization of efficient mm-wave 3D interconnects up to 60GHz is discussed.