Narrow Results

In this study, TiO₂ coatings are deposited on Si(100) wafers by direct current pulsed magnetron sputtering technology. The crystal structure of TiO₂ coatings gradually transforms from the anatase phase to the amorphous phase when the sputtering power is decreased from 900W to 150W. Besides, the growth surface temperature of TiO₂ coatings decreases from 630${}^{\circ }$C to 241${}^{\circ }$C. The relationship between the growth behavior and growth surface temperature of TiO₂ coatings is investigated using the dynamic scaling theory. The results show that in the first stage, the growth behavior of TiO₂ coatings gradually transforms from the Frank–van der Merwe mode to the Volmer–Weber mode with decreasing sputtering power from 900W to 150W. In the second stage, the growth behavior of TiO₂ coatings gradually transforms from the Stranski–Krastanov mode to the Volmer–Weber mode. Transformation of the growth behavior of TiO₂ coatings in the second stage transforms the crystal structure of TiO₂ coatings from the anatase phase to the amorphous phase.