This study investigates how thermal conditions affect the nanomachining of FeCoNiCrAl high-entropy alloys, using molecular dynamics simulations at 100K, 150K and 200K. Key findings include a direct relationship between stress intensification and machining velocity at all temperatures, with stress concentrating at intergranular boundaries. At subsonic speeds (<200m/s), stress inversely correlates with temperature, while at supersonic speeds (>200m/s), stress increases with temperature. Incremental cutting depths affect chip morphology, with chips at 150K being 1.38 times thicker than at 200K. Minimum machining forces were 94.5Nn, 101.2Nn and 92.5Nn along [100], and 87.3Nn, 85.3Nn and 86.1Nn along [001]. Dislocation densities showed higher values at lower temperatures, with peak 1/2 〈110〉 densities at 100K being 1.43 and 1.45 times greater than at 150K and 200K, respectively.