Narrow Results

In this study, path-independent values of the J-integral in the finite element context for an arbitrary three-dimensional interface crack configuration in welds of dissimilar steels are presented. For the fracture mechanics analysis of an interface crack in welds of dissimilar steels, residual stress analysis and fracture analysis must be performed sequentially. In the analysis of cracked bodies containing residual stress, the usual domain integral formation results in path-dependent values of the J-integral. And unlike cracks in homogeneous materials, an interface crack in welds of dissimilar steels always induces both opening and shearing modes of stress in the vicinity of the crack tip. Therefore, this paper discusses modifications of the conventional J-integral that yield path independence in the presence of residual stress and the total J values which can characterize the severity of an interface crack tip in welds of dissimilar steels. A finite element method which can evaluate the J-integral for an interface crack in three-dimensional residual stress bearing bodies is developed using the modified J-integral definition and total J values. The situation when residual stresses only are present is studied as is the case when mechanical stresses are applied in conjunction with a residual stress field.

A recently proposed criterion is used to study the behavior of debonds produced at a fiber–matrix interface. The criterion is based on the Linear Elastic–(Perfectly) Brittle Interface Model (LEBIM) combined with a Finite Fracture Mechanics (FFM) approach, where the stress and energy criteria are suitably coupled. Special attention is given to the discussion about the symmetry of the debond onset and growth in an isolated single fiber specimen under uniaxial transverse tension. A common composite material system, glass fiber–epoxy matrix, is considered. The present methodology uses a two-dimensional (2D) Boundary Element Method (BEM) code to carry out the analysis of interface failure. The present results show that a non-symmetrical interface crack configuration (debonds at one side only) is produced by a lower critical remote load than the symmetrical case (debonds at both sides). Thus, the non-symmetrical solution is the preferred one, which agrees with the experimental evidences found in the literature.

The peeling behavior of a thin film bonded to a substrate is investigated by using the cohesive interface model. We compare the peeling processes of film/substrate interfaces with three different geometric shapes, including a flat interface, a curved interface of sinusoidal shape, and a wavy interface with two-level sinusoidal hierarchy. The effect of the peeling angle on the maximal peeling strength is also examined. It is demonstrated that the peeling strength can be significantly improved by introducing a hierarchical wavy morphology at the film/substrate interface. This study may be helpful for the design of film/substrate systems with enhanced mechanical properties.