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Wake-up receivers (WuRxs) allow wireless sensor nodes to run on battery power while maintaining asynchronous, low-latency communication. This paper focuses on WuRxs based on low-frequency pattern matchers (LFPMs). Many recent studies either investigate physical WuRx implementations or simulate WuRx-based protocols. Our goal is to address the challenges that arise when realizing WuRx-based protocols in hardware. These challenges are, that a packet activates unwanted WuRxs, an unreliable address space, and missing cluster broadcast capabilities. The proposed separation sequences and run-length limited patterns ensure a reliable address space. WuRxs based on LFPMs use a fixed pattern matching. Cluster broadcasts are enabled by the proposed variable Manchester coding. Typically, LFPMs use Manchester coding with an efficiency of only 0.5 bit/symbol. We introduce two non-Manchester coding techniques with higher efficiency: lookup table-based coding with an efficiency of 0.71 and 3S2B coding with an efficiency of 0.67.

Due to the influence of diverse factors, travel time is highly uncertain. Travelers are eager to find the most reliable path in multimodal networks to reduce the penalty caused by late arrival. However, the research considering the traveler preferences in multimodal transportation networks to solve the reliable path problem with given budgets is limited. Thus, we propose two multimodal reliable path models to find personalized and reliable paths. First, we build a multimodal network based on smart card data to incorporate the multimodal transfers between public and private transportation and solve corresponding parking issues effectively. Next, we build a multimodal time-reliable path model to find time-reliable paths. Further, considering traveler preferences, we design a multimodal utility-reliable path model to find personalized and reliable paths. A novel two-factor reliability bound convergence algorithm is developed to solve the proposed models and proved for its theoretical feasibility. Finally, a real-world case study is used to verify the effectiveness and efficiency of the proposed models and algorithm.

Reliable and Fast Diagnosis of Influenza Virus.

Agilent Technologies Introduces Industry's First HPLC-Chip/MS System for Proteomics Research.

As the portable electronics industry continually drives electronic assemblies to higher functionality in smaller form factors, material compatibility and thermal dissipation issues are becoming considerably more acute. Most of the current approaches attempt to marry conventional materials technologies in order to achieve as much leverage as possible out of the established infrastructure. However, concurrent engineering of reliable, high-density electronic assemblies will require the introduction of a new material technology.

A novel base technology that is applicable to all of the major packaging and redistribution elements in an electronic module is presented. A single family of polymer/metal composite conductors can be used for chip packaging redistribution layers, multichip module or multilayer PWB interconnects, and SMT assembly. High-density multilayer circuits with landless blind and buried vias can be fabricated by filling the conductor paste into photoimaged dielectrics and thermal processing. Via layers are prepared directly on the inherently planarized circuit layer in an identical fashion. Building up layers sequentially in this manner results in multilayer circuits built on a single substrate layer and minimizes the number of interfaces between dissimilar materials. Because these composite materials are applied in an additive fabrication method, metal substrates can be employed for high thermal dissipation and excellent CTE control over a wide temperature range. Two variants of the composite conductor can successfully replace solder for surface mount and chip on board assembly. These reliable, highly-thermally and electrically conductive materials are compatible with the standard metal finishes of conventional technologies and can be adopted piecemeal as desired; however, the largest reliability and cost benefit is realized when all of the elements are used in conjunction with one another.

The conductor materials are based on interpenetrating polymer and metal networks that are formed in situ from metal particles and a thermosetting flux/binder. The metal network is formed when the alloy particles melt and react with adjacent high-melting point metal particles. Interaction also occurs between the alloy particles and pad, lead or previous trace metallizations provided they are solderable by alloys of tin. The new alloy composition created by the interdiffusion process within the bulk material has a higher melting point than the original alloy and thus solidifies immediately upon formation. This metallurgical reaction, known as transient liquid phase sintering, is facilitated by the polymer mixture. Integration of the polymer and metal networks is maintained by utilizing a thermosetting polymer system that cures simultaneously with the metallurgical reaction. Although similar in concept and performance to cermet inks, these compositions differ in that their process temperatures are compatible with conventional printed wiring board materials and that the polymeric binder remains to provide adhesion and fatigue resistance to the metallurgical network.