Multichip modules (MCMs): a review of the status quo

Multichip modules (MCMs) are an advanced packaging technique that features greater packing density and performance than traditional packaging technologies. At present, the lack of a merchant MCM infrastructure and high costs are together limiting the widespread use of MCM technologies outside the captive markets. However, in the near future, current packaging technologies will not be able to deliver the equivalent size, weight and reliability advantages offered by MCM technology. Evidence shows that MCMs are migrating towards low- and mid-range computer applications thanks to technological advancements and to the increased demands for higher performance within this market. This paper presents MCM classifications, design issues, interconnection techniques, trends in the technology and the changing marketplace and applications for these packaging systems.