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Some of the forces pushing technology today are system speed, reliability, and cost of manufacturing. System speed has become less limited by gate speeds causing signal-line length to be the dominant factor. Shortening the distance between IC dies implies multi-chip modules. Reliability of circuit systems is a function of, among other things, the number of interconnections within the circuit system. Research needs to continue along several directions. This paper discusses a strategy for selecting materials and choosing fabrication processes based on the cost and availability of materials, equipment and facility. The density and performance that can be obtained within each silicon die will continue to improve. However, future advances in silicon technology will require substantial investment. The functionality of presently available silicon dies is adequate for most high-volume consumer applications. Development of the packaging and manufacturing systems for application of these dies can afford great benefits in terms of overall module costs. Research investment in these areas offers a potential for good returns with low risk. There is an urgent need for consideration of manufacturing systems aspects in the design of future electronics packaging.

Multichip modules (MCMs) are an advanced packaging technique that features greater packing density and performance than traditional packaging technologies. At present, the lack of a merchant MCM infrastructure and high costs are together limiting the widespread use of MCM technologies outside the captive markets. However, in the near future, current packaging technologies will not be able to deliver the equivalent size, weight and reliability advantages offered by MCM technology. Evidence shows that MCMs are migrating towards low- and mid-range computer applications thanks to technological advancements and to the increased demands for higher performance within this market. This paper presents MCM classifications, design issues, interconnection techniques, trends in the technology and the changing marketplace and applications for these packaging systems.