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Chirped superlattices are of interest as buffer layers in metamorphic semiconductor device structures, because they can combine the mismatch accommodating properties of compositionally-graded layers with the dislocation filtering properties of superlattices. Important practical aspects of the chirped superlattice as a buffer layer are the surface strain and surface in-plane lattice constant. In this work two basic types of InGaAs/GaAs chirped superlattice buffers have been studied. In design I (composition modulated), the average composition is varied by modulating the composition of one of the two layers in the superlattice period, but the individual layer thicknesses were fixed. In design II (thickness modulated), the individual layer thicknesses were modulated, but the compositions were fixed. In this paper the surface strain and surface in-plane lattice constant for these chirped superlattices are presented as functions of the top composition and period for each of these basic designs.

Metamorphic realization of semiconductor devices has become increasingly important due to the great freedom it affords in layer compositions and thicknesses. However, metamorphic growth is often accompanied by the introduction of high densities of threading dislocation defects. This behavior may be understood by using an annihilation and coalescence model for the threading dislocation behavior which is based on the dislocation interaction length L_int. For its application we considered only glide of dislocations, so the interaction length was assumed to be equal to the length of misfit dislocation segments L_MD. The length of misfit segments was determined approximately by the Matthews, Mader, and Light model [J. Appl. Phys., 41, 3800 (1970)] for lattice relaxation, and was assumed to be independent of the distance from the interface. Within this framework we have applied the annihilation and coalescence model to chirped semiconductor superlattices to evaluate these superlattices as strainrelaxed buffers for metamorphic devices. In this work we have studied two basic types of InGaAs/GaAs chirped superlattice buffers: type I superlattices are compositionally modulated while type II superlattices are thickness modulated.

We conducted a modeling study of the threading dislocation behavior in chirped and unchirped InGaAs/GaAs (001) strained-layer superlattices (SLSs) using a Dodson & Tsao / Kujofsa & Ayers (DTKA) type plastic flow model. Four types of SLSs were investigated: type I was chirped using compositional modulation, type II was chirped using layer thickness modulation, type III was unchirped with alternating layers of InGaAs and GaAs, and type IV was unchirped with alternating layers of InGaAs having two different compositions. Generally the surface and average values of the dislocation density decreased with increasing total thickness. The dependence on top indium composition was more complex, due to dislocation compensation and multiplication effects, but for type II and IV superlattices, the average and surface threading dislocation densities increased in nearly monotonic fashion with top indium composition. Based on these results, the compositionally-modulated chirped (type I) and InGaAs/GaAs unchirped (type III) superlattices appear to be best suited as buffer layers for metamorphic devices, while the chirped superlattices with layer thickness modulation (type II) and InGaAs/InGaAs unchirped (type IV) superlattices appear to be poorly suited for use as buffer layers for devices containing high indium content.

Metamorphic realization of semiconductor devices has become increasingly important due to the great freedom it affords in layer compositions and thicknesses. However, metamorphic growth is often accompanied by the introduction of high densities of threading dislocation defects. This behavior may be understood by using an annihilation and coalescence model for the threading dislocation behavior which is based on the dislocation interaction length L_int. For its application we considered only glide of dislocations, so the interaction length was assumed to be equal to the length of misfit dislocation segments L_MD. The length of misfit segments was determined approximately by the Matthews, Mader, and Light model [J. Appl. Phys., 41, 3800 (1970)] for lattice relaxation, and was assumed to be independent of the distance from the interface. Within this framework we have applied the annihilation and coalescence model to chirped semiconductor superlattices to evaluate these superlattices as strain-relaxed buffers for metamorphic devices. In this work we have studied two basic types of InGaAs/GaAs chirped superlattice buffers: type I superlattices are compositionally modulated while type II superlattices are thickness modulated.

We conducted a modeling study of the threading dislocation behavior in chirped and unchirped InGaAs/GaAs (001) strained-layer superlattices (SLSs) using a Dodson & Tsao / Kujofsa & Ayers (DTKA) type plastic flow model. Four types of SLSs were investigated: type I was chirped using compositional modulation, type II was chirped using layer thickness modulation, type III was unchirped with alternating layers of InGaAs and GaAs, and type IV was unchirped with alternating layers of InGaAs having two different compositions. Generally the surface and average values of the dislocation density decreased with increasing total thickness. The dependence on top indium composition was more complex, due to dislocation compensation and multiplication effects, but for type II and IV superlattices, the average and surface threading dislocation densities increased in nearly monotonic fashion with top indium composition. Based on these results, the compositionally-modulated chirped (type I) and InGaAs/GaAs unchirped (type III) superlattices appear to be best suited as buffer layers for metamorphic devices, while the chirped superlattices with layer thickness modulation (type II) and InGaAs/InGaAs unchirped (type IV) superlattices appear to be poorly suited for use as buffer layers for devices containing high indium content.

Chirped superlattices are of interest as buffer layers in metamorphic semiconductor device structures, because they can combine the mismatch accommodating properties of compositionally-graded layers with the dislocation filtering properties of superlattices. Important practical aspects of the chirped superlattice as a buffer layer are the surface strain and surface in-plane lattice constant. In this work two basic types of InGaAs/GaAs chirped superlattice buffers have been studied. In design I (composition modulated), the average composition is varied by modulating the composition of one of the two layers in the superlattice period, but the individual layer thicknesses were fixed. In design II (thickness modulated), the individual layer thicknesses were modulated, but the compositions were fixed. In this paper the surface strain and surface in-plane lattice constant for these chirped superlattices are presented as functions of the top composition and period for each of these basic designs.