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Heating Effects on Nanofabricated Plasmonic Dimers with Interconnects

Rahul Raman

Chemical and Biomolecular Engineering, University of Connecticut, 191 Auditorium Road, Storrs, CT 06269, USA

E-mail Address: Rahul.raman@uconn.edu

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John Grasso

Chemical and Biomolecular Engineering, University of Connecticut, 191 Auditorium Road, Storrs, CT 06269, USA

E-mail Address: John.grasso@uconn.edu

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Brian G. Willis

Chemical and Biomolecular Engineering, University of Connecticut, 191 Auditorium Road, Storrs, CT 06269, USA

E-mail Address: brian.willis@uconn.edu

Corresponding author.

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https://doi.org/10.1142/S0129156423500040Cited by:2 (Source: Crossref)

This article is part of the issue:

Special Issue on Nanotechnology in Electronics, Photonics, Biosensors, and Energy Systems
Guest Editors: F. Jain, C. Broadbridge, M. Gherasimova and H. Tang

Abstract

Plasmonic nanostructures with electrical connections have potential applications as new electro-optic devices due to their strong light–matter interactions. Plasmonic dimers with nanogaps between adjacent nanostructures are especially good at enhancing local electromagnetic (EM) fields at resonance for improved performance. In this study, we use optical extinction measurements and high-resolution electron microscopy imaging to investigate the thermal stability of electrically interconnected plasmonic dimers and their optical and morphological properties. Experimental measurements and finite difference time domain (FDTD) simulations are combined to characterize temperature effects on the plasmonic properties of large arrays of Au nanostructures on glass substrates. Experiments show continuous blue shifts of extinction peaks for heating up to 210°C. Microscopy measurements reveal these peak shifts are due to morphological changes that shrink nanorods and increase nanogap distances. Simulations of the nanostructures before and after heating find good agreement with experiments. Results show that plasmonic properties are maintained after thermal processing, but peak shifts need to be considered for device design.

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