No Access

Analysis of Crosstalk-Induced Effects in Multilayer Graphene Nanoribbon Interconnects

Department of AEIE, Haldia Institute of Technology, Hatiberia, Haldia 721657, West Bengal, India

E-mail Address: manodipansahoo@gmail.com

Corresponding author.

and

School of VLSI Technology, Indian Institute of Engineering Science and Technology, Shibpur, Botanical Garden, Howrah 711103, West Bengal, India

E-mail Address: hafizur@vlsi.iiests.ac.in

Search for more papers by this author

https://doi.org/10.1142/S021812661750102XCited by:10 (Source: Crossref)

Abstract

Crosstalk effects in multilayer graphene nanoribbon (GNR) interconnects for the future nanoscale integrated circuits are investigated with the help of ABCD parameter matrix approach for intermediate- and global-level interconnects at 11nm and 8nm technology nodes. The worst-case crosstalk-induced delay and peak crosstalk noise voltages are derived for both neutral and doped zigzag GNR interconnects and compared to those of conventional copper interconnects. The worst-case crosstalk delays for perfectly specular, doped multilayer GNR interconnects are less than 4% of that of copper interconnects for 1mm long intermediate interconnects and less than 7% of that of copper interconnects for 5mm long global interconnects at 8nm node. As far as the worst-case peak crosstalk noise voltage is concerned, neutral GNR interconnects are slightly better performing than their doped counterparts. But from the perspective of overall noise contribution, doped GNR interconnects outperform neutral ones for all the cases. Finally, our analysis shows that from the signal integrity perspective, perfectly specular, doped multilayer zigzag GNR interconnects are a suitable alternative to copper interconnects for the future-generation integrated circuit technology.

This paper was recommended by Regional Editor Emre Salman.

Keywords:

References

1. ITRS, International Technology Roadmap for Semiconductors (ITRS-2013) reports (2013), http://www.itrs.net/reports.html. Google Scholar
2. S. M. Rossnagel and T. S. Kuan , Alteration of Cu conductivity in the size effect regime, J. Vac. Sci. Technol. B, Microelectron. Process. Phenom. 22 (2004) 240–247. Crossref, Web of Science, Google Scholar
3. J. Meindl , Beyond Moore’s law: The interconnect era, Comput. Sci. Eng. 5 (2003) 20–24. Crossref, Web of Science, Google Scholar
4. S. Im, N. Srivastava, K. Banerjee and K. E. Goodson , Scaling analysis of multilevel interconnect temperatures for high-performance ICs, IEEE Trans. Electron Devices 52 (2005) 2710–2719. Crossref, Web of Science, Google Scholar
5. X. Du, I. Skachko, A. Barker and E. Y. Andrei , Approaching ballistic transport in suspended graphene, Nat. Nanotechnol. 3 (2008) 491–495. Crossref, Web of Science, Google Scholar
6. A. A. Balandin, S. Ghosh, W. Bao, I. Calizo, D. Teweldebrhan, F. Miao and C. N. Lau , Superior thermal conductivity of single-layer graphene, Nano Lett. 8 (2008) 902–907. Crossref, Web of Science, Google Scholar
7. N. Wei, Z. Fan, L.-Q. Xu, Y.-P. Zheng, H.-Q. Wang and J.-C. Zheng , Knitted graphene-nanoribbon sheet: A mechanically robust structure, Nanoscale 4 (2012) 785–791. Crossref, Web of Science, Google Scholar
8. A. Naeemi and J. D. Meindl , Performance benchmarking for graphene nanoribbon, carbon nanotube, and Cu interconnects, Proc. Int. Interconnect Technology Conf. (IITC) (2008), pp. 183–185. Google Scholar
9. X. Chen et al., High-speed graphene interconnects monolithically integrated with CMOS ring oscillators operating at 1.3GHz, Proc. IEEE IEDM (2009) 1–4. Google Scholar
10. A. Naeemi and J. D. Meindl , Compact physics-based circuit models for graphene nanoribbon interconnects, IEEE Trans. Electron Devices 56 (2009) 1822–1833. Crossref, Web of Science, Google Scholar
11. A. Naeemi and J. D. Meindl , Conductance modeling for graphene nanoribbon (GNR) interconnects, IEEE Electron Device Lett. 28 (2007) 428–431. Crossref, Web of Science, Google Scholar
12. C. Xu, H. Li and K. Banerjee , Modeling, analysis, and design of graphene nano-ribbon interconnects, IEEE Trans. Electron Devices 56 (2009) 1567–1578. Crossref, Web of Science, Google Scholar
13. S. H. Nasiri, M. K. M. Farshi and R. Faez , Stability analysis in graphene nanoribbon interconnects, IEEE Electron Device Lett. 31 (2010) 1458–1460. Crossref, Web of Science, Google Scholar
14. D. Das and H. Rahaman , Crosstalk and gate oxide reliability analysis in graphene nanoribbon interconnects, Proc. 2nd Int. Symp. Electronic System Design (ISED) (2011) 182–187. Google Scholar
15. W.-S. Zhao and W.-Y. Yin , signal integrity analysis of graphene nano-ribbon (GNR) interconnects, Proc. IEEE Electrical Design of Advanced Packaging and Systems Symp. (EDAPS) (2012), pp. 227–230. Google Scholar
16. J.-P. Cui, W. Zhao, W.-Y. Yin and, J. Hu , Signal transmission analysis of multilayer graphene nano-ribbon (MLGNR) interconnects, IEEE Trans. Electromagn. Compat. 54 (2012) 126–132. Crossref, Web of Science, Google Scholar
17. W.-S. Zhao and W.-Y. Yin , Comparative study on multilayer graphene nanoribbon (MLGNR) interconnects, IEEE Trans. Electromagn. Compat. 56 (2014) 638–645. Crossref, Web of Science, Google Scholar
18. Y. Eo, S. Shin, W. R. Eisenstadt and J. Shim , Generalized traveling wave-based waveform approximation technique for the efficient signal integrity verification of multicoupled transmission lines, IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. 21 (2002) 1489–1497. Crossref, Web of Science, Google Scholar
19. M. Sahoo, P. Ghosal and H. Rahaman , An ABCD parameter based modeling and analysis of crosstalk induced effects in single-walled carbon nanotube bundle interconnects, Proc. IEEE ASQED (2013), pp. 264–273. Google Scholar
20. M. Sahoo, P. Ghosal and H. Rahaman , An ABCD parameter based modeling and analysis of crosstalk induced effects in multiwalled carbon nanotube bundle interconnects, Proc. IEEE 27th Int. Conf. VLSI Design (2014), pp. 433–438. Google Scholar
21. M. Sahoo and H. Rahaman , An ABCD parameter based modeling and analysis of crosstalk induced effects in multilayer graphene nano ribbon interconnects, Proc. IEEE ISCAS (2014), pp. 1138–1142. Google Scholar
22. K. Banerjee and A. Mehrotra , Analysis of on-chip inductance effects for distributed RLC interconnects, IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. 21 (2002) 904–915. Crossref, Web of Science, Google Scholar
23. NIMO Group, Predictive Technology Model (2012), http://ptm.asu.edu/. Google Scholar
24. P. J. Burke , Luttinger liquid theory as a model of the gigahertz electrical properties of carbon nanotubes, IEEE Trans. Nanotechnol. 1 (2002) 129–144. Crossref, Web of Science, Google Scholar
25. M. S. Sarto and A. Tamburrano , Single-conductor transmission line model of multiwall carbon nanotubes, IEEE Trans. Nanotechnol. 9 (2010) 82–92. Crossref, Web of Science, Google Scholar
26. S. Choudhary and S. Qureshi , Inductance modelling of SWCNT bundle interconnects using partial element equivalent circuit method, J. Comput. Electron. 10 (2011) 241–247. Crossref, Web of Science, Google Scholar
27. A. Nieuwoudt and Y. Massoud , Understanding the impact of inductance in carbon nanotube bundles for VLSI interconnect using scalable modeling techniques, IEEE Trans. Nanotechnol. 5 (2006) 758–765. Crossref, Web of Science, Google Scholar
28. S. N. Pu, W. Y. Yin, J. F. Mao and Q. H. Liu , Crosstalk prediction of single- and double-walled carbon-nanotube (SWCNT/DWCNT) bundle interconnects, IEEE Trans. Electron Devices 56 (2009) 560–568. Crossref, Web of Science, Google Scholar
29. A. K. Palit, S. Hasan and W. Anheier , Decoupled victim model for the analysis of crosstalk noise between on-chip coupled interconnects, Proc. 11th Electronics Packaging Technology Conf. (2009) 697–701. Google Scholar
30. J. Zhang and E. G. Friedman , Decoupling technique and crosstalk analysis for coupled RLC interconnects, Proc. IEEE ISCAS (2004), pp. 521–524. Google Scholar
31. D. Das and H. Rahaman , Unified model for analyzing timing delay and crosstalk effects in carbon nanotube interconnects, Proc. IEEE ASQED (2012), pp. 100–109. Google Scholar
32. D. Sylvester and C. Hu , Analytical modeling and characterization of deep-submicrometer interconnect, Proc. IEEE 89 (2001) 634–664. Crossref, Web of Science, Google Scholar