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This paper presents the experimental characteristics of 3-state n-MOS inverters utilizing Quantum Dot Gate (QDG) FETs. By employing FETs that have quantum dots in the gate region, particularly Si-SiOx cladded quantum dots and Ge-GeOx cladded quantum dots, intermediate states were observed in both variations of the device, both of which using the same architecture and mask set.

This paper investigates the underlying physics of a SRAM device utilizing three-state Quantum Dot Gate (QDG) FETs by building up the physics from the general QDG-FET, its relation to the QDG-Inverter, and ultimately, the QDG-SRAM. The resulting equations from the exploration of the device physics were utilized to create a simulation within SIMULINK. From the simulation, it was found that in addition to being able to store the “1” and “0” states that are customary for an SRAM device, there is also the ability to store an intermediate state and a pseudo-state as a result of the intermediate state, allowing for the possibility of a 2-bit SRAM device in the same spatial constraints of a conventional SRAM unit cell. Additionally, the experimental results of the QDG-SRAM half-cell and the implications of utilizing a 4 state device to create either a 4 state SRAM cell or a 6 state SRAM cell with two pseudo-states are also discussed.

This paper presents fabrication of multi-state inverters incorporating SiO_x-cladded Si quantum dot in the channel and gate region of driver, load, and access transistors. Experimental characteristics are presented exhibiting 3-state behavior in Quantum-dot Channel (QDC)-Quantum-dot Gate (QDG) FETs having Si quantum dots. It is shown that QDC-QDG-FETs-based enhancement mode inverter configurations are the building blocks of a multi-bit static random access memory (SRAM). QDC-QDG-FETs exhibiting four states can also be used to implement compact 4-state logic and nonvolatile memories or random access nonvolatile memories.

This paper presents the experimental characteristics of 3-state n-MOS inverters utilizing Quantum Dot Gate (QDG) FETs. By employing FETs that have quantum dots in the gate region, particularly Si-SiOx cladded quantum dots and Ge-GeOx cladded quantum dots, intermediate states were observed in both variations of the device, both of which using the same architecture and mask set.

This paper investigates the underlying physics of a SRAM device utilizing three-state Quantum Dot Gate (QDG) FETs by building up the physics from the general QDG-FET, its relation to the QDG-Inverter, and ultimately, the QDG-SRAM. The resulting equations from the exploration of the device physics were utilized to create a simulation within SIMULINK. From the simulation, it was found that in addition to being able to store the “1” and “0” states that are customary for an SRAM device, there is also the ability to store an intermediate state and a pseudo-state as a result of the intermediate state, allowing for the possibility of a 2-bit SRAM device in the same spatial constraints of a conventional SRAM unit cell. Additionally, the experimental results of the QDG-SRAM half-cell and the implications of utilizing a 4 state device to create either a 4 state SRAM cell or a 6 state SRAM cell with two pseudo-states are also discussed.

This paper presents fabrication of multi-state inverters incorporating SiO_x-cladded Si quantum dot in the channel and gate region of driver, load, and access transistors. Experimental characteristics are presented exhibiting 3-state behavior in Quantum-dot Channel (QDC)-Quantum-dot Gate (QDG) FETs having Si quantum dots. It is shown that QDC-QDG-FETs-based enhancement mode inverter configurations are the building blocks of a multi-bit static random access memory (SRAM). QDC-QDG-FETs exhibiting four states can also be used to implement compact 4-state logic and nonvolatile memories or random access nonvolatile memories.