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Additively Manufactured RF Devices for 5G, IoT, RFID, WSN, and Smart City Applications

School of Electrical and Computer Engineering, Georgia Institute of Technology, 85 5th St NW, Atlanta, Georgia 30308, USA

E-mail Address: yepu.cui@gatech.edu

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Eui Min Jung

School of Electrical and Computer Engineering, Georgia Institute of Technology, 85 5th St NW, Atlanta, Georgia 30308, USA

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Ajibayo Adeyeye

School of Electrical and Computer Engineering, Georgia Institute of Technology, 85 5th St NW, Atlanta, Georgia 30308, USA

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Charles Lynch

School of Electrical and Computer Engineering, Georgia Institute of Technology, 85 5th St NW, Atlanta, Georgia 30308, USA

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Xuanke He

School of Electrical and Computer Engineering, Georgia Institute of Technology, 85 5th St NW, Atlanta, Georgia 30308, USA

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, and

Manos Tentzeris

School of Electrical and Computer Engineering, Georgia Institute of Technology, 85 5th St NW, Atlanta, Georgia 30308, USA

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https://doi.org/10.1142/S0129156420400169Cited by:3 (Source: Crossref)

This article is part of the issue:

Special Issue on Nanotechnology for Electronics, Biosensors, Additive Manufacturing and Emerging Systems Applications
Guest Editors: F. Jain, C. Broadbridge, M. Gherasimova and H. Tang

Abstract

With the development of inkjet-/3D-/4D-printing additive manufacturing technologies, flexible 3D substrate with complex structures can be patterned with dielectric, conductive and semi-conductive materials to realize novel RF designs. This paper provides a review of state-of-the-art additively manufactured passive RF devices including antennas and frequency selective surfaces (FSS), couplers, where origami-inspired structure enables unprecedented capabilities of on-demand continuous frequency tunability and deployability. This paper also discusses additively manufactured active RF modules and systems such as inkjet printed RF energy harvester system with high sensitivity and efficiency for Internet of Things (IoT), smart cities and wireless sensor networks (WSN) applications, inkjet-printed RF front ends, and inkjet-printed mm-wave backscatter modules.

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